[ CourseWikia Com ] 3D Microelectronic Packaging - From Architectures To Applications

[ CourseWikia.com ] 3D Microelectronic Packaging: From Architectures to Applications



If You Need More Stuff, kindly Visit and Support Us -->> https://CourseWikia.com







English | PDF,EPUB (True)| 2021 | 629 Pages | ISBN : 9811570892 | 249.9 MB



This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.



If You Need More Stuff, kindly Visit and Support Us -->> https://FreeCourseWeb.com



Get Latest Tips and Tricks and Support Us -->> https://DevCourseWeb.com



We upload these learning materials for the people from all over the world, who have the talent and motivation to sharpen their skills/ knowledge but do not have the financial support to afford the materials. If you like this content and if you are truly in a position that you can actually buy the materials, then Please, we repeat, Please, Support Authors. They Deserve it! Because always remember, without "Them", you and we won't be here having this conversation. Think about it! Peace...